App DescriptionIC package, but the package of the future will be smaller and smaller, thinner and thinner.
Early package to DIP later to SOP, TSOP, TSSOP, QFN, TQFP package now, some of the high-end equipment to use the CSP, MCM, WSP and new packaging.
The integrated circuit package also has a feature, is the number of pins more and more, most have reached thousands of pins.
General name beginning with the letter "C" before the ceramic package and plastic package beginning with "P", "H" for high-temperature high-power device package name. Ceramic package for the military, working temperature of at of -55 ° of C ~~ 125 ° C. Plastic packages generally work from 0 degrees to 70 degrees in civil products, can reach -45 ° C ~ 85 ° C industrial grade.
The lead used in the integrated circuit package, and more generally for the Gold Line, part of the performance requirements of the use of aluminum wire, now packaging factory began to try to use copper wire encapsulation. Most expensive gold wire, and also the best. Aluminum worst, but the cheapest. Copper hardness, the wire success rate is not high. Prior to the design of the PCB, we generally have to go to get the chip, pin pitch and other parameters measured with calipers. Income of some commonly used packages in this application, and convenient circuit engineers in chip premise to reference. Some other documents in the application, and the hope that useful.
PDF document format included, the data can be sent to Email in the form can also be printed.
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January 12, 2013 Initial Release